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An introduction to mixed-signal IC test and measurement.

By: Contributor(s): Material type: TextSeries: The Oxford series in electrical and computer engineeringPublication details: New York : Oxford University Press, 2012.Edition: 2nd ed. / Gordon Roberts, Friedrich Taenzler, Mark BurnsDescription: xxv, 836 p. : ill. ; 24 cmISBN:
  • 9780199796212 (hbk. : alk. paper)
Subject(s): DDC classification:
  • 621.3815 23
LOC classification:
  • TK7874 .B825 2012
Other classification:
  • TEC008010 | TEC008020
Contents:
Machine generated contents note: -- Table of Contents -- Preface -- CHAPTER 1. OVERVIEW OF MIXED-SIGNAL TESTING 1 -- 1.1 MIXED-SIGNAL CIRCUITS 1 -- 1.1.1 Analog, Digital, or Mixed-Signal? 1 -- 1.1.2 Common Types of Analog and Mixed-Signal Circuits 2 -- 1.1.3 Applications of Mixed-Signal Circuits 3 -- 1.2 WHY TEST MIXED-SIGNAL DEVICES? 5 -- 1.2.1 The CMOS Fabrication Process 5 -- 1.2.2 Real-World Circuits 6 -- 1.2.3 What Is a Test Engineer? 8 -- 1.3 POST-SILICON PRODUCTION FLOW 9 -- 1.3.1 Test and Packaging 9 -- 1.3.2 Characterization versus Production Testing 10 -- 1.4 TEST AND DIAGNOSTIC EQUIPMENT 10 -- 1.4.1 Automated Test Equipment 10 -- 1.4.2 Wafer Probers 12 -- 1.4.3 Handlers 12 -- 1.4.4 E-Beam Probers 13 -- 1.4.5 Focused Ion Beam Equipment 13 -- 1.4.6 Forced-Temperature Systems 13 -- 1.5 NEW PRODUCT DEVELOPMENT 13 -- 1.5.1 Concurrent Engineering 13 -- 1.6 MIXED-SIGNAL TESTING CHALLENGES 15 -- 1.6.1 Time to Market 15 -- 1.6.2 Accuracy, Repeatability, and Correlation 15 -- 1.6.3 Electromechanical Fixturing Challenges 15 -- 1.6.4 Economics of Production Testing 16 -- CHAPTER 2. TESTER HARDWARE 19 -- 2.1 MIXED-SIGNAL TESTER OVERVIEW 19 -- 2.1.1 General-Purpose Testers versus Focused Bench Equipment 19 -- 2.1.2 Generic Tester Architecture 19 -- 2.2 DC RESOURCES 20 -- 2.2.1 General-Purpose Multimeters 20 -- 2.2.2 General-Purpose Voltage/Current Sources 23 -- 2.2.3 Precision Voltage References and User Supplies 24 -- 2.2.4 Calibration Source 24 -- 2.2.5 Relay Matrices 24 -- 2.2.6 Relay Control Lines 25 -- 2.3 DIGITAL SUBSYSTEM 26 -- 2.3.1 Digital Vectors 26 -- 2.3.2 Digital Signals 26 -- 2.3.3 Source Memory 27 -- 2.3.4 Capture Memory 27 -- 2.3.5 Pin Card Electronics 27 -- 2.3.6 Timing and Formatting Electronics 29 -- 2.4 AC SOURCE AND MEASUREMENT 32 -- 2.4.1 AC Continuous Wave Source and AC Meter 32 -- 2.4.2 Arbitrary Waveform Generators 32 -- 2.4.3 Waveform Digitizers 33 -- 2.4.4 Clocking and Synchronization 34 -- 2.5 TIME MEASUREMENT SYSTEM 35 -- 2.5.1 Time Measurements 35 -- 2.5.2 Time Measurement Interconnects 35 -- 2.6 RF-SUBSYSTEM 36 -- 2.6.1 Source Path 36 -- 2.6.2 Measurement Path 37 -- 2.7 COMPUTING HARDWARE 37 -- 2.7.1 User Computer 37 -- 2.7.2 Tester Computer 38 -- 2.7.3 Array Processors and Distributed Digital Signal Processors 38 -- 2.7.4 Network Connectivity 39 -- 2.8 SUMMARY 39 -- CHAPTER 3. DC AND PARAMETRIC MEASUREMENTS 41 -- 3.1 CONTINUITY 41 -- 3.1.1 Purpose of Continuity Testing 41 -- 3.1.2 Continuity Test Technique 41 -- 3.1.3 Serial versus Parallel Continuity Testing 44 -- 3.2 LEAKAGE CURRENTS 46 -- 3.2.1 Purpose of Leakage Testing 46 -- 3.2.2 Leakage Test Technique 46 -- 3.2.3 Serial versus Parallel Leakage Testing 46 -- 3.3 POWER SUPPLY CURRENTS 47 -- 3.3.1 Importance of Supply Current Tests 47 -- 3.3.2 Test Techniques 47 -- 3.4 DC REFERENCES AND REGULATORS 48 -- 3.4.1 Voltage Regulators 48 -- 3.4.2 Voltage References 50 -- 3.4.3 Trimmable References 50 -- 3.5 IMPEDANCE MEASUREMENTS 51 -- 3.5.1 Input Impedance 51 -- 3.5.2 Output Impedance 54 -- 3.5.3 Differential Impedance Measurements 54 -- 3.6 DC OFFSET MEASUREMENTS 55 -- 3.6.1 VMID and Analog Ground 55 -- 3.6.2 DC Transfer Characteristics (Gain and Offset) 56 -- 3.6.3 Output Offset Voltage (VO,OS) 56 -- 3.6.4 Single-Ended, Differential, and Common-Mode Offsets 58 -- 3.6.5 Input Offset Voltage (VIN,OS) 60 -- 3.7 DC GAIN MEASUREMENTS 60 -- 3.7.1 Closed-Loop Gain 60 -- 3.7.2 Open-Loop Gain 63 -- 3.8 DC POWER SUPPLY REJECTION RATIO 66 -- 3.8.1 DC Power Supply Sensitivity 66 -- 3.8.2 DC Power Supply Rejection Ratio 67 -- 3.9 DC COMMON-MODE REJECTION RATIO 68 -- 3.9.1 CMRR of Op Amps 68 -- 3.9.2 CMRR of Differential Gain Stages 70 -- 3.10 COMPARATOR DC TESTS 72 -- 3.10.1 Input Offset Voltage 72 -- 3.10.2 Threshold Voltage 72 -- 3.10.3 Hysteresis 73 -- 3.11 VOLTAGE SEARCH TECHNIQUES 74 -- 3.11.1 Binary Searches versus Step Searches 74 -- 3.11.2 Linear Searches 75 -- 3.12 DC TESTS FOR DIGITAL CIRCUITS 78 -- 3.12.1 IIH/IIL 78 -- 3.12.2 VIH/VIL 78 -- 3.12.3 VOH/VOL 79 -- 3.12.4 IOH/IOL 79 -- 3.12.5 IOSH and IOSL Short Circuit Current 79 -- 3.13 SUMMARY 79 -- CHAPTER 4. DATA ANALYSIS AND PROBABILITY THEORY 83 -- 4.1 DATA VISUALIZATION TOOLS 83 -- 4.1.1 Datalogs (Data Lists) 83 -- 4.1.2 Lot Summaries 84 -- 4.1.3 Wafer Maps 86 -- 4.1.4 Shmoo Plots 87 -- 4.1.5 Histograms 90 -- 4.2 STATISTICAL ANALYSIS 90 -- 4.2.1 Mean (Average) and Standard Deviation (Variance) 90 -- 4.2.2 Probabilities and Probability Density Functions 93 -- 4.2.3 The Standard Gaussian Cumulative Distribution Function ?(z) 96 -- 4.2.4 Verifying Gaussian Behavior: The Kurtosis and -- Normal Probability Plot 100 -- 4.3 NON-GAUSSIAN DISTRIBUTIONS FOUND IN MIXED-SIGNAL TEST 104 -- 4.3.1 The Uniform Probability Distribution 104 -- 4.3.2 The Sinusoidal Probability Distribution 106 -- 4.3.3 The Binomial Probability Distribution 109 -- 4.4 MODELING THE STRUCTURE OF RANDOMNESS 111 -- 4.4.1 Modeling A Gaussian Mixture Using The -- Expectation-Maximization Algorithm 113 -- 4.4.2 Probabilities Associated With A Gaussian Mixture Model 118 -- 4.5 SUMS AND DIFFERENCES OF RANDOM VARIABLES 120 -- 4.5.1 The Central Limit Theorem 124 -- 4.6 SUMMARY 125 -- CHAPTER 5 YIELD, MEASUREMENT ACCURACY AND -- TEST TIME 131 -- 5.1 YIELD 131 -- 5.2 MEASUREMENT TERMINOLOGY 133 -- 5.2.1 Accuracy and Precision 133 -- 5.2.2 Systematic Or Bias Errors 134 -- 5.2.3 Random Errors 134 -- 5.2.4 Resolution (Quantization Error) 134 -- 5.2.5 Repeatability 135 -- 5.2.6 Stability 136 -- 5.2.7 Correlation 136 -- 5.2.8 Reproducibility 138 -- 5.3 A MATHEMATICAL LOOK AT REPEATABILITY, BIAS AND ACCURACY 138 -- 5.4 CALIBRATIONS AND CHECKERS 145 -- 5.4.1 Traceability to Standards 146 -- 5.4.2 Hardware Calibration 146 -- 5.4.3 Software Calibration 147 -- 5.4.4 System Calibrations and Checkers 148 -- 5.4.5 Focused Instrument Calibrations 149 -- 5.4.6 Focused DIB Circuit Calibrations 153 -- 5.5 TESTER SPECIFICATIONS 155 -- 5.6 REDUCING MEASUREMENT ERROR WITH GREATER -- MEASUREMENT TIME 157 -- 5.6.1 Analog Filtering 157 -- 5.6.2 Averaging 159 -- 5.7 GUARDBANDS 160 -- 5.8 EFFECTS OF MEASUREMENT VARIABILITY ON TEST YIELD 165 -- 5.9 EFFECTS OF REPRODUCIBILTY AND PROCESS VARIATION -- ON YIELD 167 -- 5.10 STATISTICAL PROCESS CONTROL 171 -- 5.10.1 Goals of SPC 171 -- 5.10.2 Six-Sigma Quality 173 -- 5.10.3 Process Capability, Cp, and Cpk 173 -- 5.10.4 Gauge Repeatability and Reproducibility 175 -- 5.11 SUMMARY 175 -- CHAPTER 6 DAC TESTING 181 -- 6.1 BASICS OF DATA CONVERTERS 182 -- 6.1.1 Principles of DAC and ADC Conversion 182 -- 6.1.2 Data Formats 186 -- 6.1.3 Comparison of DACs and ADCs 190 -- 6.1.4 DAC Failure Mechanisms 191 -- 6.2 BASIC DC TESTS 192 -- 6.2.1 Code-Specific Parameters 192 -- 6.2.2 Full-Scale Range 192 -- 6.2.3 DC Gain, Gain Error, Offset, and Offset Error 192 -- 6.2.4 LSB Step Size 195 -- 6.2.5 DC PSS 195 -- 6.3 TRANSFER CURVE TESTS 196 -- 6.3.1 Absolute Error 196 -- 6.3.2 Monotonicity 198 -- 6.3.3 Differential Nonlinearity 198 -- 6.3.4 Integral Nonlinearity 201 -- 6.3.5 Partial Transfer Curves 204 -- 6.3.6 Major Carrier Testing 204 -- 6.3.7 Other Selected-Code Techniques 207 -- 6.4 DYNAMIC DAC TESTS 209 -- 6.4.1 Conversion Time (Settling Time) 209 -- 6.4.2 Overshoot and Undershoot 210 -- 6.4.3 Rise Time and Fall Time 210 -- 6.4.4 DAC-to-DAC Skew 211 -- 6.4.5 Glitch Energy (Glitch Impulse) 212 -- 6.4.6 Clock and Data Feedthrough 212 -- 6.5 TESTS FOR COMMON DAC APPLICATIONS 213 -- 6.5.1 DC References 213 -- 6.5.2 Audio Reconstruction 214 -- 6.5.3 Data Modulation 214 -- 6.5.4 Video Signal Generators 215 -- 6.6 SUMMARY 215 -- CHAPTER 7 ADC TESTING 221 -- 7.1 ADC TESTING VERSUS DAC TESTING 221 -- 7.1.1 Comparison of DACs and ADCs 221 -- 7.1.2 Statistical Behavior of ADCs 221 -- 7.2 ADC CODE EDGE MEASUREMENTS 226 -- 7.2.1 Edge Code Testing versus Center Code Testing 226 -- 7.2.2 Step Search and Binary Search Methods 227 -- 7.2.3 Servo Method 228 -- 7.2.4 Linear Ramp Histogram Method 229 -- 7.2.5 Conversion from Histograms to Code Edge Transfer Curves 231 -- 7.2.6 Accuracy Limitations of Histogram Testing 232 -- 7.2.7 Rising Ramps versus Falling Ramps 235 -- 7.2.8 Sinusoidal Histogram Method 236 -- 7.3 DC TESTS AND TRANSFER CURVE TESTS 244 -- 7.3.1 DC Gain and Offset 244 -- 7.3.2 INL and DNL 245 -- 7.3.3 Monotonicity and Missing Codes 248 -- 7.4 DYNAMIC ADC TESTS 249 -- 7.4.1 Conversion Time, Recovery Time, and Sampling Frequency 249 -- 7.4.2 Aperture Jitter 252 -- 7.4.3 Sparkling 252 -- 7.5 TESTS FOR COMMON ADC APPLICATIONS 253 -- 7.5.1 DC Measurements 253 -- 7.5.2 Audio Digitization 253 -- 7.5.3 Data Transmission 253 -- 7.5.4 Video Digitization 254 -- 7.6 SUMMARY 254 -- CHAPTER 8 SAMPLING THEORY 259 -- 8.1 ANALOG MEASUREMENTS USING DSP 259 -- 8.1.1 Traditional versus DSP-Based Testing of AC Parameters 259 -- 8.2 SAMPLING AND RECONSTRUCTION 260 -- 8.2.1 Use of Sampling and Reconstruction in Mixed-Signal Testing 260 -- 8.2.2 Sampling: Continuous-Time and Discrete-Time Representation 260 -- 8.2.3 Reconstruction 264 -- 8.2.4 The Sampling Theorem and Aliasing 269 -- 8.2.5 Quantization Effects 271 -- 8.2.6 Sampling Jitter 276 -- 8.3 REPETITIVE SAMPLE SETS 283 -- 8.3.1 Finite and Infinite Sample Sets 283 -- 8.3.2 Coherent Signals and Noncoherent Signals 284 -- 8.3.3 Peak-to-RMS Control in Coherent Multitones 286 -- 8.3.4 Spectral Bin Selection 287 -- 8.4 SYNCHRONIZATION OF SAMPLING SYSTEMS 292 -- 8.4.1 Simultaneous Testing of Multiple Sampling Systems 292 -- 8.4.2 ATE Clock Sources 294 -- 8.5 SUMMARY 296 -- CHAPTER 9 DSP-BASED TESTING 299 -- 9.1 ADVANTAGES OF DSP-BASED TESTING 299 -- 9.1.1Reduced Test Time 299 -- 9.1.2 Separation of Signal Components 299 -- 9.1.3 Advanced Signal Manipulations 300 -- 9.2 DIGITAL SIGNAL PROCESSING 300 -- 9.2.1 DSP and Array Processing 300 -- 9.2.2 Fourier Analysis of Periodic Signals 301 -- 9.2.3 The Trigonometric Fourier Series 301 -- 9.2.4 The Discrete-Time Fourier Series 305 -- 9.2.5 Complete Frequency Spectrum 314 -- 9.2.6 Time and Frequency Denormalization 318 --
Summary: "With the proliferation of complex semiconductor devices containing digital, analog, mixed-signal and radio-frequency circuits, the economics of test has come to the forefront and today's engineer needs to be fluent in all four circuit types. Having access to a book that covers these topics will help the evolving test engineer immensely and will be an invaluable resource. In addition, the second edition includes lengthy discussion on RF circuits, high-speed I/Os and probabilistic reasoning. Appropriate for the junior/senior university level, this textbook includes hundreds of examples, exercises and problems"--Summary: "This contains the title page, copyright page, table of contents, first chapter, last chapter, and appendices"--
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Holdings
Item type Current library Call number Status Barcode
Book Meru University Open Shelves TK7874 .B8 2012 (Browse shelf(Opens below)) Available 18-31689
Total holds: 0

Burns' name appears first on the previous edition.

Includes bibliographical references and index.

Machine generated contents note: -- Table of Contents -- Preface -- CHAPTER 1. OVERVIEW OF MIXED-SIGNAL TESTING 1 -- 1.1 MIXED-SIGNAL CIRCUITS 1 -- 1.1.1 Analog, Digital, or Mixed-Signal? 1 -- 1.1.2 Common Types of Analog and Mixed-Signal Circuits 2 -- 1.1.3 Applications of Mixed-Signal Circuits 3 -- 1.2 WHY TEST MIXED-SIGNAL DEVICES? 5 -- 1.2.1 The CMOS Fabrication Process 5 -- 1.2.2 Real-World Circuits 6 -- 1.2.3 What Is a Test Engineer? 8 -- 1.3 POST-SILICON PRODUCTION FLOW 9 -- 1.3.1 Test and Packaging 9 -- 1.3.2 Characterization versus Production Testing 10 -- 1.4 TEST AND DIAGNOSTIC EQUIPMENT 10 -- 1.4.1 Automated Test Equipment 10 -- 1.4.2 Wafer Probers 12 -- 1.4.3 Handlers 12 -- 1.4.4 E-Beam Probers 13 -- 1.4.5 Focused Ion Beam Equipment 13 -- 1.4.6 Forced-Temperature Systems 13 -- 1.5 NEW PRODUCT DEVELOPMENT 13 -- 1.5.1 Concurrent Engineering 13 -- 1.6 MIXED-SIGNAL TESTING CHALLENGES 15 -- 1.6.1 Time to Market 15 -- 1.6.2 Accuracy, Repeatability, and Correlation 15 -- 1.6.3 Electromechanical Fixturing Challenges 15 -- 1.6.4 Economics of Production Testing 16 -- CHAPTER 2. TESTER HARDWARE 19 -- 2.1 MIXED-SIGNAL TESTER OVERVIEW 19 -- 2.1.1 General-Purpose Testers versus Focused Bench Equipment 19 -- 2.1.2 Generic Tester Architecture 19 -- 2.2 DC RESOURCES 20 -- 2.2.1 General-Purpose Multimeters 20 -- 2.2.2 General-Purpose Voltage/Current Sources 23 -- 2.2.3 Precision Voltage References and User Supplies 24 -- 2.2.4 Calibration Source 24 -- 2.2.5 Relay Matrices 24 -- 2.2.6 Relay Control Lines 25 -- 2.3 DIGITAL SUBSYSTEM 26 -- 2.3.1 Digital Vectors 26 -- 2.3.2 Digital Signals 26 -- 2.3.3 Source Memory 27 -- 2.3.4 Capture Memory 27 -- 2.3.5 Pin Card Electronics 27 -- 2.3.6 Timing and Formatting Electronics 29 -- 2.4 AC SOURCE AND MEASUREMENT 32 -- 2.4.1 AC Continuous Wave Source and AC Meter 32 -- 2.4.2 Arbitrary Waveform Generators 32 -- 2.4.3 Waveform Digitizers 33 -- 2.4.4 Clocking and Synchronization 34 -- 2.5 TIME MEASUREMENT SYSTEM 35 -- 2.5.1 Time Measurements 35 -- 2.5.2 Time Measurement Interconnects 35 -- 2.6 RF-SUBSYSTEM 36 -- 2.6.1 Source Path 36 -- 2.6.2 Measurement Path 37 -- 2.7 COMPUTING HARDWARE 37 -- 2.7.1 User Computer 37 -- 2.7.2 Tester Computer 38 -- 2.7.3 Array Processors and Distributed Digital Signal Processors 38 -- 2.7.4 Network Connectivity 39 -- 2.8 SUMMARY 39 -- CHAPTER 3. DC AND PARAMETRIC MEASUREMENTS 41 -- 3.1 CONTINUITY 41 -- 3.1.1 Purpose of Continuity Testing 41 -- 3.1.2 Continuity Test Technique 41 -- 3.1.3 Serial versus Parallel Continuity Testing 44 -- 3.2 LEAKAGE CURRENTS 46 -- 3.2.1 Purpose of Leakage Testing 46 -- 3.2.2 Leakage Test Technique 46 -- 3.2.3 Serial versus Parallel Leakage Testing 46 -- 3.3 POWER SUPPLY CURRENTS 47 -- 3.3.1 Importance of Supply Current Tests 47 -- 3.3.2 Test Techniques 47 -- 3.4 DC REFERENCES AND REGULATORS 48 -- 3.4.1 Voltage Regulators 48 -- 3.4.2 Voltage References 50 -- 3.4.3 Trimmable References 50 -- 3.5 IMPEDANCE MEASUREMENTS 51 -- 3.5.1 Input Impedance 51 -- 3.5.2 Output Impedance 54 -- 3.5.3 Differential Impedance Measurements 54 -- 3.6 DC OFFSET MEASUREMENTS 55 -- 3.6.1 VMID and Analog Ground 55 -- 3.6.2 DC Transfer Characteristics (Gain and Offset) 56 -- 3.6.3 Output Offset Voltage (VO,OS) 56 -- 3.6.4 Single-Ended, Differential, and Common-Mode Offsets 58 -- 3.6.5 Input Offset Voltage (VIN,OS) 60 -- 3.7 DC GAIN MEASUREMENTS 60 -- 3.7.1 Closed-Loop Gain 60 -- 3.7.2 Open-Loop Gain 63 -- 3.8 DC POWER SUPPLY REJECTION RATIO 66 -- 3.8.1 DC Power Supply Sensitivity 66 -- 3.8.2 DC Power Supply Rejection Ratio 67 -- 3.9 DC COMMON-MODE REJECTION RATIO 68 -- 3.9.1 CMRR of Op Amps 68 -- 3.9.2 CMRR of Differential Gain Stages 70 -- 3.10 COMPARATOR DC TESTS 72 -- 3.10.1 Input Offset Voltage 72 -- 3.10.2 Threshold Voltage 72 -- 3.10.3 Hysteresis 73 -- 3.11 VOLTAGE SEARCH TECHNIQUES 74 -- 3.11.1 Binary Searches versus Step Searches 74 -- 3.11.2 Linear Searches 75 -- 3.12 DC TESTS FOR DIGITAL CIRCUITS 78 -- 3.12.1 IIH/IIL 78 -- 3.12.2 VIH/VIL 78 -- 3.12.3 VOH/VOL 79 -- 3.12.4 IOH/IOL 79 -- 3.12.5 IOSH and IOSL Short Circuit Current 79 -- 3.13 SUMMARY 79 -- CHAPTER 4. DATA ANALYSIS AND PROBABILITY THEORY 83 -- 4.1 DATA VISUALIZATION TOOLS 83 -- 4.1.1 Datalogs (Data Lists) 83 -- 4.1.2 Lot Summaries 84 -- 4.1.3 Wafer Maps 86 -- 4.1.4 Shmoo Plots 87 -- 4.1.5 Histograms 90 -- 4.2 STATISTICAL ANALYSIS 90 -- 4.2.1 Mean (Average) and Standard Deviation (Variance) 90 -- 4.2.2 Probabilities and Probability Density Functions 93 -- 4.2.3 The Standard Gaussian Cumulative Distribution Function ?(z) 96 -- 4.2.4 Verifying Gaussian Behavior: The Kurtosis and -- Normal Probability Plot 100 -- 4.3 NON-GAUSSIAN DISTRIBUTIONS FOUND IN MIXED-SIGNAL TEST 104 -- 4.3.1 The Uniform Probability Distribution 104 -- 4.3.2 The Sinusoidal Probability Distribution 106 -- 4.3.3 The Binomial Probability Distribution 109 -- 4.4 MODELING THE STRUCTURE OF RANDOMNESS 111 -- 4.4.1 Modeling A Gaussian Mixture Using The -- Expectation-Maximization Algorithm 113 -- 4.4.2 Probabilities Associated With A Gaussian Mixture Model 118 -- 4.5 SUMS AND DIFFERENCES OF RANDOM VARIABLES 120 -- 4.5.1 The Central Limit Theorem 124 -- 4.6 SUMMARY 125 -- CHAPTER 5 YIELD, MEASUREMENT ACCURACY AND -- TEST TIME 131 -- 5.1 YIELD 131 -- 5.2 MEASUREMENT TERMINOLOGY 133 -- 5.2.1 Accuracy and Precision 133 -- 5.2.2 Systematic Or Bias Errors 134 -- 5.2.3 Random Errors 134 -- 5.2.4 Resolution (Quantization Error) 134 -- 5.2.5 Repeatability 135 -- 5.2.6 Stability 136 -- 5.2.7 Correlation 136 -- 5.2.8 Reproducibility 138 -- 5.3 A MATHEMATICAL LOOK AT REPEATABILITY, BIAS AND ACCURACY 138 -- 5.4 CALIBRATIONS AND CHECKERS 145 -- 5.4.1 Traceability to Standards 146 -- 5.4.2 Hardware Calibration 146 -- 5.4.3 Software Calibration 147 -- 5.4.4 System Calibrations and Checkers 148 -- 5.4.5 Focused Instrument Calibrations 149 -- 5.4.6 Focused DIB Circuit Calibrations 153 -- 5.5 TESTER SPECIFICATIONS 155 -- 5.6 REDUCING MEASUREMENT ERROR WITH GREATER -- MEASUREMENT TIME 157 -- 5.6.1 Analog Filtering 157 -- 5.6.2 Averaging 159 -- 5.7 GUARDBANDS 160 -- 5.8 EFFECTS OF MEASUREMENT VARIABILITY ON TEST YIELD 165 -- 5.9 EFFECTS OF REPRODUCIBILTY AND PROCESS VARIATION -- ON YIELD 167 -- 5.10 STATISTICAL PROCESS CONTROL 171 -- 5.10.1 Goals of SPC 171 -- 5.10.2 Six-Sigma Quality 173 -- 5.10.3 Process Capability, Cp, and Cpk 173 -- 5.10.4 Gauge Repeatability and Reproducibility 175 -- 5.11 SUMMARY 175 -- CHAPTER 6 DAC TESTING 181 -- 6.1 BASICS OF DATA CONVERTERS 182 -- 6.1.1 Principles of DAC and ADC Conversion 182 -- 6.1.2 Data Formats 186 -- 6.1.3 Comparison of DACs and ADCs 190 -- 6.1.4 DAC Failure Mechanisms 191 -- 6.2 BASIC DC TESTS 192 -- 6.2.1 Code-Specific Parameters 192 -- 6.2.2 Full-Scale Range 192 -- 6.2.3 DC Gain, Gain Error, Offset, and Offset Error 192 -- 6.2.4 LSB Step Size 195 -- 6.2.5 DC PSS 195 -- 6.3 TRANSFER CURVE TESTS 196 -- 6.3.1 Absolute Error 196 -- 6.3.2 Monotonicity 198 -- 6.3.3 Differential Nonlinearity 198 -- 6.3.4 Integral Nonlinearity 201 -- 6.3.5 Partial Transfer Curves 204 -- 6.3.6 Major Carrier Testing 204 -- 6.3.7 Other Selected-Code Techniques 207 -- 6.4 DYNAMIC DAC TESTS 209 -- 6.4.1 Conversion Time (Settling Time) 209 -- 6.4.2 Overshoot and Undershoot 210 -- 6.4.3 Rise Time and Fall Time 210 -- 6.4.4 DAC-to-DAC Skew 211 -- 6.4.5 Glitch Energy (Glitch Impulse) 212 -- 6.4.6 Clock and Data Feedthrough 212 -- 6.5 TESTS FOR COMMON DAC APPLICATIONS 213 -- 6.5.1 DC References 213 -- 6.5.2 Audio Reconstruction 214 -- 6.5.3 Data Modulation 214 -- 6.5.4 Video Signal Generators 215 -- 6.6 SUMMARY 215 -- CHAPTER 7 ADC TESTING 221 -- 7.1 ADC TESTING VERSUS DAC TESTING 221 -- 7.1.1 Comparison of DACs and ADCs 221 -- 7.1.2 Statistical Behavior of ADCs 221 -- 7.2 ADC CODE EDGE MEASUREMENTS 226 -- 7.2.1 Edge Code Testing versus Center Code Testing 226 -- 7.2.2 Step Search and Binary Search Methods 227 -- 7.2.3 Servo Method 228 -- 7.2.4 Linear Ramp Histogram Method 229 -- 7.2.5 Conversion from Histograms to Code Edge Transfer Curves 231 -- 7.2.6 Accuracy Limitations of Histogram Testing 232 -- 7.2.7 Rising Ramps versus Falling Ramps 235 -- 7.2.8 Sinusoidal Histogram Method 236 -- 7.3 DC TESTS AND TRANSFER CURVE TESTS 244 -- 7.3.1 DC Gain and Offset 244 -- 7.3.2 INL and DNL 245 -- 7.3.3 Monotonicity and Missing Codes 248 -- 7.4 DYNAMIC ADC TESTS 249 -- 7.4.1 Conversion Time, Recovery Time, and Sampling Frequency 249 -- 7.4.2 Aperture Jitter 252 -- 7.4.3 Sparkling 252 -- 7.5 TESTS FOR COMMON ADC APPLICATIONS 253 -- 7.5.1 DC Measurements 253 -- 7.5.2 Audio Digitization 253 -- 7.5.3 Data Transmission 253 -- 7.5.4 Video Digitization 254 -- 7.6 SUMMARY 254 -- CHAPTER 8 SAMPLING THEORY 259 -- 8.1 ANALOG MEASUREMENTS USING DSP 259 -- 8.1.1 Traditional versus DSP-Based Testing of AC Parameters 259 -- 8.2 SAMPLING AND RECONSTRUCTION 260 -- 8.2.1 Use of Sampling and Reconstruction in Mixed-Signal Testing 260 -- 8.2.2 Sampling: Continuous-Time and Discrete-Time Representation 260 -- 8.2.3 Reconstruction 264 -- 8.2.4 The Sampling Theorem and Aliasing 269 -- 8.2.5 Quantization Effects 271 -- 8.2.6 Sampling Jitter 276 -- 8.3 REPETITIVE SAMPLE SETS 283 -- 8.3.1 Finite and Infinite Sample Sets 283 -- 8.3.2 Coherent Signals and Noncoherent Signals 284 -- 8.3.3 Peak-to-RMS Control in Coherent Multitones 286 -- 8.3.4 Spectral Bin Selection 287 -- 8.4 SYNCHRONIZATION OF SAMPLING SYSTEMS 292 -- 8.4.1 Simultaneous Testing of Multiple Sampling Systems 292 -- 8.4.2 ATE Clock Sources 294 -- 8.5 SUMMARY 296 -- CHAPTER 9 DSP-BASED TESTING 299 -- 9.1 ADVANTAGES OF DSP-BASED TESTING 299 -- 9.1.1Reduced Test Time 299 -- 9.1.2 Separation of Signal Components 299 -- 9.1.3 Advanced Signal Manipulations 300 -- 9.2 DIGITAL SIGNAL PROCESSING 300 -- 9.2.1 DSP and Array Processing 300 -- 9.2.2 Fourier Analysis of Periodic Signals 301 -- 9.2.3 The Trigonometric Fourier Series 301 -- 9.2.4 The Discrete-Time Fourier Series 305 -- 9.2.5 Complete Frequency Spectrum 314 -- 9.2.6 Time and Frequency Denormalization 318 --

"With the proliferation of complex semiconductor devices containing digital, analog, mixed-signal and radio-frequency circuits, the economics of test has come to the forefront and today's engineer needs to be fluent in all four circuit types. Having access to a book that covers these topics will help the evolving test engineer immensely and will be an invaluable resource. In addition, the second edition includes lengthy discussion on RF circuits, high-speed I/Os and probabilistic reasoning. Appropriate for the junior/senior university level, this textbook includes hundreds of examples, exercises and problems"--

"This contains the title page, copyright page, table of contents, first chapter, last chapter, and appendices"--

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